ENHANCED RELIABILITY
AND DURABILITY

The new S2 shingled module is composed of one-sixth laser-cut 158.75mm cells. By splitting cells, the smaller currents will help reduce “Cell to Module” loss, resulting in higher power outputs. No ribbon soldering brings lower internal resistance, enhances overall toughness, reduces the probability of cracking, and avoids the impact of metal corrosion. The busbar-free design also completely avoids the shielding of ribbon, thereby increasing the utilization of sunlight.